1,000 CFETs, SK Hynix Next-Gen NAND, Interconnects Beyond ...
1 day ago · There are plenty of innovations on the bench that are promising for the next decade and beyond. In this report, as with 2022, 2023, and 2024, we’ll cover highlights from IEDM …
Techmeme: Highlights from IEDM 2025: 3D NAND is suddenly ...
1 day ago · Highlights from IEDM 2025: 3D NAND is suddenly relevant again, interconnect metals beyond copper are emerging, 2D materials that could replace silicon, and more — IEDM 2025 …
Highlights from the 2025 IEEE International Electron Devices ...
Dec 5, 2025 · The IEEE International Electron Devices Meeting (IEDM), which takes place in San Francisco in December, is a key forum for reporting developments in semiconductor and …
Cryogenic Etch: A Key Enabler Of 3D NAND
Jan 5, 2026 · Next-gen 3D NAND depends on the performance and repeatability of cryogenic etching processes
NAND Flash Innovations and Future Scaling - IEEE Xplore
Since its first appearance in 1987, NAND flash memory technologies have been successfully developed for nearly 4 decades. A tremendous amount of innovation has been made in …
Inside the future of 3D NAND: The roadmap to 500 layers
Aug 6, 2025 · For now, the majority of 3D NAND-based devices, including SSDs and smartphones, rely on memory with 2xx layers, with each layer holding an incredible number of …
Scaling to 1,000-Layer 3D NAND in the AI Era - Counterpoint
Scaling to 1,000-Layer 3D NAND in the AI EraPDF | 17 pages Published date: August 2024 OverviewAs the demand for 3D NAND Flash surges, the industry is preparing for a leap to …