New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

PCIe 6, released in January 2022, introduced a data transfer rate of 64 GT/s (gigatransfers per second), double that of its ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

Increasing complexity of semiconductor devices necessitates a fundamental rethinking of defect detection methodologies.

Xtreme Pooling allows any test processor on a Pin Scale 5000 card to store vector data in other test processors’ ...

Key applications for GenAI and the features they enable, as well as an examination of how model growth and differing model ...

At GTC 2025, Nvidia CEO Jensen Huang projected $1 trillion in global data center CapEx by 2028. At this pace, data center ...