A focus on DRAM and NAND is squeezing NOR wafer capacity and backend test resources. The memory sector is entering a major ...

Embedded World 2026 made one thing clear: AI is no longer confined to the cloud—it’s moving decisively onto the device.

With the ISO/PAS 8800 certification — which bolsters our ISO 26262 and ISO/SAE 21434 certifications — we have demonstrated ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...

Security must be addressed at the platform level to ensure every security-relevant chiplet has an identity that can be ...

Why smarter charging, battery management, and power conversion are now the real differentiators in EVs and edge systems.

Whether caused by cosmic radiation, voltage glitches, or adversarial attacks, bit flips threaten data integrity, safety ...

Boinapally: This is a fundamental change for EDA. A lot of design is mundane work, where you have to do it over and over ...

How physical AI systems combine sensors, edge processing, and connectivity to enable real-time, intelligent decision-making ...

A novel IO-ICP makes radar-SLAM more accurate than other sensor-based SLAM applications.

How integrating pre-silicon side-channel analysis into your standard verification process can reduce respins, support ...

Complex interactions challenge verification; dynamic voltage drop analysis; chiplet framework; automotive Ethernet.