NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

As demand shifts for dual-die Blackwell products, Nvidia reportedly increases CoWoS-L orders while possibly reducing orders ...

Nvidia's new Blackwell roadmap for 2025 prioritizes multi-die variants with CoWoS-L packaging, impacting CoWoS-S suppliers.

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system ...

Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use ...

Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The ...

Jensen Huang, CEO of Nvidia, who visited Taiwan, stated that the demand for advanced packaging (CoWoS) from TSMC is rapidly ...

Changing its Blackwell architectural plan, Nvidia ( NVDA, Financials) is reordering its product line and supply chain focus.

Nvidia's most sophisticated AI chip, named Blackwell, is composed of several chips merged using a complex chip on wafer on ...

Nvidia ( NASDAQ:NVDA) is making a major shift in its AI chip packaging strategy, transitioning from CoWoS-S to CoWoS-L as it ...