Macronix integrates cryptographic authentication, secure boot and tamper protection into flash memory to strengthen connected-device security.

Apple's foldable iPhone is attracting early demand, but display reliability, hinge engineering and software adaptation remain challenges.

The 200,000-square-foot Pyeongtaek facility will expand local manufacturing capacity, with production targeted for 2H 2028.

Mobilint's REGULUS integrates Ceva sensing and neural processing IP to deliver 10 TOPS at under 3W for edge AI applications.

Nordic has demonstrated Bluetooth High Data Throughput in silicon, enabling faster data transfers while retaining BLE compatibility.

Introduction Join us for a webinar where we dive into how MEMS switches are transforming high-speed loopback testing in AI ...

Cadence will provide AI-enabled design, simulation and engineering expertise to DOE laboratories working on advanced ...

Global PC shipments declined 21% YoY in 3Q 2026 as elevated memory and other component costs continued to push up PC prices ...

Siemens expands agentic AI workflow for faster signoff-grade electrothermal analysis across complex 3D IC package designs.

Glass handling, PVD process limits and cost of ownership are key challenges as Von Ardenne develops deposition systems for ...

New NPU family targets edge and data centre inference, with higher compute density and improved energy efficiency. Ceva Inc. has introduced a next-generation NeuPro neural processing unit (NPU) ...

Distributor will showcase supplier products, engineering resources and digital tools at its Munich exhibition booth in November.