The specification is backward compatible with UniPro v2.0.

(NASDAQ: SNPS) today announced the appointment of Peter A. Shimer to its board of directors. Shimer brings four decades of experience at international public accounting firm Deloitte where he held ...

Baya Systems, a pioneer in software-driven, chiplet-ready semiconductor fabric IP for scalable AI, high-performance computing (HPC), and automotive applications, today announced a partnership with ...

sensiBel’s SBM100B is a fusion of high-precision technologies, all orchestrated to elevate sound capture to unprecedented levels of accuracy. By leveraging Sofics’ silicon-proven ESD IP, sensiBel also ...

UET-TSS-IP-369, an inline, high-performance, multi-channel packet engine that provides a complete TSS layer at rates up to 1.6Tbps. It embeds the UET-TSS-IP-69 as processing data path and complements ...

VerveSemi Microelectronics Secures $10M Series A to Accelerate Global Semiconductor Footprint What is the news?

Modern AI workloads demand new operators, execution patterns, precision formats, and data-movement behaviors. Supporting them requires coordinated changes across instruction sets, microarchitectures, ...

Data center digital twins are transforming data center design from assumption-based planning to physics-backed simulation—well before the first rack is deployed. By combining physics simulations with ...

Seoul, South Korea – SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced today that it has secured a design win from Niobium, a U.S.-based leader in Fully ...

Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution. The solution provides a fast, predictable pathfinding, planning and ...

The MIPI M-PHY v5.0 IP introduced by M31 strictly complies with MIPI Alliance specifications and delivers per-lane data rates of up to 23.32Gbps in HS-G5 (High Speed Gear 5) mode—doubling the ...

Initially, security was considered outside the scope of the UALink specification, with the assumption that higher layers would address it. However, as the protocol matured, the need for integrated ...