With the ISO/PAS 8800 certification — which bolsters our ISO 26262 and ISO/SAE 21434 certifications — we have demonstrated ...

Whether caused by cosmic radiation, voltage glitches, or adversarial attacks, bit flips threaten data integrity, safety ...

Security must be addressed at the platform level to ensure every security-relevant chiplet has an identity that can be ...

RAAAM is a deep-tech startup spun out of Bar-Ilan University through the Cadence University Incubator Program. They’ve ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...

Security must be treated as a core silicon architecture decision early on, especially for long‑lived, automotive, and multi‑vendor systems. Automotive cybersecurity now requires a holistic approach ...

Why smarter charging, battery management, and power conversion are now the real differentiators in EVs and edge systems.

A focus on DRAM and NAND is squeezing NOR wafer capacity and backend test resources. The memory sector is entering a major ...

Embedded World 2026 made one thing clear: AI is no longer confined to the cloud—it’s moving decisively onto the device.

A novel IO-ICP makes radar-SLAM more accurate than other sensor-based SLAM applications.

How integrating pre-silicon side-channel analysis into your standard verification process can reduce respins, support ...

Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, ...