IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Ottawa, Dec. 05, 2025 (GLOBE NEWSWIRE) -- According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is projected to expand from USD 5.35 billion ...

The global semiconductor manufacturing equipment market is expected to surge from USD 166.35 billion in 2025 to USD 344.36 ...

Quick Read Advanced packaging is becoming a key driver of semiconductor progress, focusing less on shrinking transistors and more on how components like memory and logic dies are packaged together for ...

Semiconductor chips are sorely needed right now, especially for the auto industry. It's why new cars are hard to come by, and also why some manufacturers have lots full of hundreds — even thousands of ...

Glass Interposers Market Poised for Strong Growth as Advanced Semiconductor Packaging and High-Performance Computing Demand Accelerates: Verified Market Research (R) The global Glass Interposers ...

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...

TSMC first developed its CoWoS package for advanced chips in 2012 and combined with HBM in 2016. The explosion of generative AI technology such as ChatGPT has been a catalyst for growth of TSMC’s ...

In five words or less can you describe what a semiconductor is? Some might say a computer chip, others may say they are “space magic,” but I would venture that most people have never heard the word ...

Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...

All of this is prompting chip designers to explore new strategies to dial down the heat. These include using exotic materials like graphene and diamond, incorporating advanced packaging techniques ...