Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

Signing Day Sports also announced that it will hold a special meeting of its stockholders (the “Special Meeting”) on March 13, 2026, at which stockholders will be asked to consider and vote on the ...

Signing Day Sports, Inc. ("Signing Day Sports" or the "Company") (NYSE American: SGN), today announced that the Registration Statement on Form S-4 (the ...

Keysight Technologies, Inc. launches 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the complexity of designing 3D interconnects ...

The low-noise, high-gain properties needed for high-performance quantum computing can be realized in a microwave photonic circuit device called a Josephson traveling-wave parametric amplifier (JTWPA), ...

GAINESVILLE, Fla. (WCJB) - In this week’s Tech Tuesday, our partners at UF Innovate and SCAD Media highlight HIPER-X, a ...

When light passes through materials, it typically changes direction and bends in predictable ways. This change in direction, known as refraction, is caused by a change in the speed of light as it ...

The announcement of the AMD and Tata Consultancy Services (TCS) partnership to bring the Helios rack-scale AI architecture to India marks a significant hardware milestone for the nation’s ...