LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...

Soaring AI/HPC device demand is driving leading-edge foundries to support the transition from wafers to panels to accommodate increasingly larger device sizes. But to ensure that panels with multiple ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR) today announced that it has completed the acquisition of NANIUM S.A., a world class provider of wafer-level fan-out (WLFO) ...

The ongoing trend of automotive electrification, intelligentization and connectivity are driving a significant increase in the quantity and cost of chips used in vehicles. The cost of a single chip in ...