New BGAP520 PCIe NVMe product family addresses need for soldered-down and small module form factor Flash storage for industrial embedded market segments NEWARK, Calif., Dec. 08, 2020 (GLOBE NEWSWIRE) ...
Assuming position as one of the largest, full-pattern-capable, open-top sockets available, the 3M Textool brand Type IV, 0.8-mm, open-top BGA test and burn-in socket now accepts packages on a 0.8-mm ...
The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
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