ORLANDO, Fla., September 27, 2024--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive ...
Manufacturing of semiconductor chips involves cutting the wafers, first: The process is known as wafer dicing and produces “chips” or “die”. Typical challenges in wafer dicing applications include ...
ORLANDO, Fla.--(BUSINESS WIRE)--Laser Photonics Corporation (LPC) (NASDAQ: LASE), a leading global industrial developer of systems for laser cutting, marking and other material applications, announced ...
Jenoptik has sold an emerging laser materials processing technology to fellow German company 3D-Micromac. The thermal laser separation technology, known as ‘TLS-Dicing’, can be used to separate ...
Fonon Well-Positioned To Capitalize on Wafer Dicing Market Growth With BlackStar Laser Dicing System
ORLANDO, Fla.--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...
The FINANCIAL — Panasonic Corporation, and Tokyo Seimitsu Co., Ltd. (hereinafter Tokyo Seimitsu) on March 12 announced that Tokyo Seimitsu and Panasonic’s subsidiary’s company, Panasonic Smart Factory ...
New Delhi, May 20, 2024 (GLOBE NEWSWIRE) -- The global wafer dicing services market stood at US$ 578.8 million in 2023. It is expected to reach US$ 838.9 million by 2032, growing at a moderate CAGR of ...
Dublin-based equipment maker Xsil today said it is ready to ship a fully automated laser-dicing tool for thin wafers that it says works without chipping or cracking. Once upon a time within the ...
The MarketWatch News Department was not involved in the creation of this content. Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material ...
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