At this week's HotChips 34 conference, Intel CEO Pat Gelsinger laid out his company's vision for the future, and a cornerstone of that vision is advanced packaging combining multiple chiplets. That's ...
Intel Corp. has unveiled a new transistor dielectric material that it says will boost performance and dramatically reduce current leakage in next-generation chips. The advancement could enable Intel ...
SAN FRANCISCO -- Intel Corp. said Wednesday that it has redesigned the electronic switches on its chips so that computers can keep getting cheaper and more powerful. The switches, known as transistors ...
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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024
Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...
Claiming a major technical breakthrough, Intel has developed a 3D transistor allowing increased density and performance. 32nm planar transistors Instead of implementing the transistor as a flat ...
Intel Wednesday demonstrated its revolutionary three-dimensional (3-D) Tri-Gate transistor technology in a 22-nm microprocessor, code-named Ivy Bridge, that is already being used in prototype laptops, ...
Intel said on Wednesday it will release its first Xeon server chips with 3D transistors this quarter, in a move that analysts said would intensify the cloud hardware battle with rival Advanced Micro ...
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