Soaring AI/HPC device demand is driving leading-edge foundries to support the transition from wafers to panels to accommodate increasingly larger device sizes. But to ensure that panels with multiple ...

Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on ...

Opportunities in advanced packaging arise from increasing semiconductor complexity, demand for compact electronics, automotive electronics growth, and high-performance computing. Trends include 3D IC ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed at assisting companies ...

Nordson Electronics Solutions continues to develop fluid dispensing systems to meet the challenges of semiconductor advanced packaging that ensure high-throughput, precise fluid dispensing results.