Nowadays, instrumented indentation is routinely used in quality control as well as in many different areas of industrial and academic research. This technique is generally known as nanoindentation ...

The reliability of soldered connections in electronic packaging depends on mechanical integrity; mechanical failure can cause electrical failure. Mechanical integrity, in turn, depends on mechanical ...

Nanoindentation is a measurement technique which is important in measuring Young’s modulus and hardness in thin films and any other situations involving the measurement of limited amounts of material.