LONDON — The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, has established a task group to address the needs of OEMs that are taking the lead on lead ...

Designed for cooling BGA components in low airflow velocity conditions, the EX2 heat sink is 9 mm high, suiting it for use inside low-profile enclosures. Its case-to-ambient thermal resistance is 1.8 ...

A.R.T. has upgraded its UK facility by installing the latest BGA rework system from PDR Rework for use in its training ...

NESS ZIONA, Israel, April 25, 2019 /PRNewswire/ -- Nano Dimension Ltd., a leading additive electronics provider for electronics (NASDAQ, TASE: NNDM), announced today that the company's pioneering ...

Designed for the STMicroelectronics 35-mm and 27-mm package sizes, the SG-BGA-6245 and SG-BGA-6246 sockets operate at bandwidths up to 8 GHz with less than 1-dB insertion loss. The sockets dissipate ...

Supporting a 10-GHz bandwidth, the SS-BGA324K-01 socket accommodates BGA ICs with a 0.5-mm pitch and can dissipate up to 7W without a heatsink or up to 60W with a custom heatsink. The component can ...