Ottawa, Aug. 09, 2023 (GLOBE NEWSWIRE) -- The global automotive packaging market size is predicted to reach around 11,830 million by 2029, According to Precedence Research. The automotive sector has ...
The Global Automotive Parts Packaging Market size is expected to reach USD 9.9 billion by 2024 and is further anticipated to reach USD 14.9 billion by 2033 at a CAGR of 4.7 % according to Dimension ...
As the complexity of automotive chips grows, so does the complexity of the package. In fact, packaging is becoming increasingly crucial to the performance and reliability of the chips, and both parts ...
The MicroLeadFrame (MLF)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications ...
LONDON--(BUSINESS WIRE)--Technavio has been monitoring the automotive parts packaging market and it is poised to grow by USD 1.89 bn during 2019-2023, progressing at a CAGR of over 4% during the ...
Manufacturers capable of delivering such end-to-end services are often preferred partners, as they reduce the complexity of project management for end users. Turnkey solutions also help ensure better ...
ADAS and electrification are driving the automotive IC packaging market to a 10% CAGR between 2018 and 2024, says Yole Developpement.packaging’s growth in this industry Most IDMs are not willing to ...
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