Aurora, IL, Jan. 24, 2011 (GLOBE NEWSWIRE) -- Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and a growing ...
Copper interconnect was introduced to the mainstream at 130nm because of its significant advantages compared to aluminum, such as reduction in resistivity and power consumption and resistance to ...
Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
As per Fact.MR, aluminum oxide CMP slurry will continue to dominate the global CMP slurry market, accounting for around 50% of global demand and share in 2021. Rising sales of aluminum oxide CMP ...
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