Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...

PITTSBURGH, Penn., June 8 — ANSYS, the global leader and innovator of engineering simulation software, announced today that it has entered into a definitive merger agreement with Gear Design Solutions ...

How an integrated chip–package co-analysis can quickly and accurately model package layout for inclusion in on-chip power integrity simulations. Ansys RedHawk-CPA is an integrated chip–package ...

As manufacturers struggle to keep up with demands for smaller, faster, more power-efficient high-performance electronics, one solution from Ansys and Microsoft provides relief. As wireless ...

PITTSBURGH — August 24, 2022 – Ansys (NASDAQ: ANSS) said today that Ansys Mechanical is one of the first commercial finite element analysis (FEA) programs supporting AMD Instinct accelerators, the ...

Simulation tools are now available to simulate complex gear measurements after heat-treatment simulation. This is the focus of the feature article that has just been published in Thermal Processing, ...