May 23, 2011, 10:17 AM EDT / Source: GlobeNewswire ROCK HILL, S.C., May 23, 2011 (GLOBE NEWSWIRE) -- 3D Systems (Nasdaq:TDSC) announced today the launch of a new desktop 3D Printer, the BfB™ 3000 plus ...
ARLINGTON, Va. & LAUSANNE, Switzerland--(BUSINESS WIRE)--CAES, the leading provider of RF technologies and related mission critical electronic solutions, and SWISSto12, the leading provider of 3D ...
For decades, traditional lithography techniques—such as electron beam lithography and nanoimprinting—have struggled to meet the demand for ultra-fine, high-aspect-ratio structures in general. Similar ...
Additive manufacturing (AM) technology has become a major enabling factor in the fabrication of a wide variety of new and complex dielectric and conductive structures for RF applications. Researchers ...
In a leap forward for miniaturized electronics, researchers have unveiled a groundbreaking method to fabricate high-aspect-ratio 3D microstructures with sub-10 micron resolution—tackling one of the ...